Laser Cut Stencils
100% laser-cut SMT stencils with ±4 micron precision, 8 foil thicknesses and a full range of specialty stencil types — produced in-house with same-day turnaround.
Standard Laser Cut Stencils
Our core product — 100% laser-cut SMT stencils from stainless steel foil, cut on LPKF–YAG laser equipment to ±4 micron axial precision over the full 600×600mm working area. Trapezoidal apertures with an 8 micron taper give optimum solder paste release.
Specialist Stencil Types
From step and relief stencils to BGA repair and inspection templates — we supply the full range for mixed-technology and rework applications.
Step Stencils
Step stencils incorporate varying foil thickness in specific areas of a single stencil — enabling simultaneous printing for both standard pitch and fine-pitch components, as well as paste-in-hole applications. Steps are chemically etched on the squeegee side to precisely control paste volume in defined zones.
- Combines standard and fine-pitch zones
- Supports paste-in-hole (PIH) regions
- Chemically etched squeegee-side steps
- Accurate paste volume control per zone
Relief Stencils
Relief stencils feature areas chemically etched away to accommodate PCB features such as component labels, peelable solder masks, tracks or filled vias. The recessed areas improve gasket sealing against the PCB surface and minimise paste squeeze-out.
- Accommodates tracks, labels & filled vias
- Improved gasket seal and seating
- Reduces paste contamination
- Minimises equipment damage risk
Paste-in-Hole (PIH) Stencils
PIH stencils enable intrusive reflow assembly — combining surface mount and through-hole leaded components in a single reflow pass. This eliminates a secondary wave soldering process, reducing production steps and cost without compromising joint quality.
- Combines SMT and through-hole in one pass
- Eliminates secondary wave soldering
- Reduces production complexity & cost
- Suitable for intrusive reflow methodology
Glue Dot Stencils
Designed to deposit epoxy adhesive dots of controlled height for component bonding prior to reflow. Surface tension between the adhesive and stencil aperture walls determines dot height, controlled by aperture size and stencil thickness.
- Controlled adhesive dot height
- Aperture-size-determined volume
- Compatible with standard SMT printers
- Suitable for under-component bonding
BGA Repair Stencils
Precision stencils for accurate reworking of BGA and QFP packages. Allow quick and accurate re-balling and solder deposit for component rework without requiring hand-soldering.
- Accurate BGA and QFP rework
- Supplied with full specifications
- Optional mini squeegee available
- Reduces rework time and error rate
PCB Inspection Templates
Low-cost inline inspection tools produced from laser-cut stainless steel or other suitable materials. Placed over the assembled PCB to visually reveal missing, misplaced or misaligned components.
- Reveals missing/misplaced components
- Low-cost inline quality check
- Laser-cut for precise aperture alignment
- Compatible with all standard board layouts
Squeegee Blades
Replacement SMT squeegee blades for stencil printing machines, available in standard and custom lengths to suit a range of printer platforms.
- Standard and custom lengths available
- Consistent hardness and flatness
- Suitable for various printer platforms
- Contact us for specifications
In-House CAD Engineering
Our in-house engineering team handles all CAD data processing, paste file generation and aperture optimisation — data processed within one hour of receipt.
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Request a stencil quote today
Send us your Gerber files or DXF data and we'll respond with a same-day quote. Our engineering team processes data within one hour.