Products & Equipment
Precision laser-cut stencils, metal parts, framing systems, printers, and cleaning equipment for PCB assembly.
Laser Cut Stencils
All stencils are cut on LPKF–YAG laser equipment to ±4 micron axial precision over the full 600×600mm working area. Trapezoidal apertures to the internationally preferred 8-micron taper for optimum paste release.
Laser Cut Stencils
Precision SMT stencils for solder paste deposition on printed wiring boards. Available in a full range of foil thicknesses to suit your process requirements.
Step & Relief Stencils
For PCBs that combine standard and fine-pitch SMT components on the same board. Step stencils have varying foil thickness in defined areas; relief stencils feature etched recesses for labels, masks, or vias.
- Accommodate mixed-pitch component layouts
- Step areas reduce paste volume for fine-pitch devices
- Relief etching for board features and labels
Paste-in-Hole (PIH) Stencils
Cost-effective assembly of boards with both surface mount and through-hole leaded components using intrusive reflow technology. Eliminates a separate soldering operation.
- Intrusive reflow — one reflow oven pass
- Reduces assembly cost for mixed boards
- IPC-compliant aperture design
Glue Dot Stencils
Replace dispensing machines using existing process equipment. Deposits dots of varying heights based on aperture size and stencil thickness.
PCB Inspection Templates
Quick component verification against layout. Delivery within 3–4 working days. Ideal for production quality checks.
BGA Repair Stencils
Enables rapid rework and replacement of faulty BGA components using flux and solder paste. Precise aperture alignment for reliable results.
Precision Metal Parts
Laser cutting and chemical photo-etching for prototype and volume production of precision metal components. No tooling costs, same-day prototyping available.
Laser Cut Parts
Same-day prototype and volume production. No tooling costs. LPKF–YAG laser equipment cuts a wide range of metals to tight tolerances.
- No tooling costs — immediate prototyping
- Same-day prototype service
- LPKF–YAG laser for precision cuts
- Suitable for prototype to volume orders
Chemical Etched Parts
Photo-chemical etching (also called chemical milling) produces intricate components to close tolerances. Suitable for flat metal parts with complex features.
- Photo-chemical (photochemical) etching process
- Close tolerances on complex geometries
- Burr-free edges, no heat-affected zones
- Suitable for thin metals and fine features
RF Cans
Electromagnetic shielding cans for RF-sensitive circuits, produced via two methods:
With nickel plating for conductivity and corrosion resistance.
With optional tin plating for solderability.
Stencil Frames
Pneumatic, Zelflex, and VectorGuard framing systems provide accurate, consistent stencil tensioning for fast deployment across multiple projects.
Pneumatic Frames
Four-sided stretch frames for fast clamping of metal stencils. Perfect tensioning across the full stencil — no continuous air connection required during printing.
- Fast exchange — changeover in one minute
- Perfect, even tensioning all over the stencil
- One frame used across multiple stencil projects
- No air connection needed during printing
Zelflex Protect Frames
Stencil held in equally distributed tension with adjustable air pressure. Features innovative perforation for quick, repetitive stencil changes.
- Patented air-compression tensioning system
- Uniform tension across the work surface
- Adjustable air pressure
- Quick foil exchange with perforated design
DEK VectorGuard
Unique patented tensioning system — not air-pressure dependent. Provides automatic, accurate tensioning requiring minimal operator training.
- Not air-pressure dependent
- Automatic, accurate tensioning
- Minimal training required
- Significant advantages over mesh-mounted systems
Prototype & Pre-Production Stencil Printer
Stencil printing is the process of depositing solder paste on printed wiring boards (PWBs) to establish electrical connections between components and board pads. Our prototype printer enables professional results for new designs and pre-production runs.
- Vertical and horizontal stencil separation for optimum paste deposit
- Professional assembly quality for prototype boards
- Reduces the complexity of setting up new designs
- Available for demonstration at our Midrand facility
SAWA Ultrasonic Stencil Cleaners
Effectively removes solder paste from fine-pitch apertures using ultrasonic vibration applied directly to the stencil. Three models available to suit different production volumes.
SC-5000GBS
The SAWA 5000 applies ultrasonic vibration directly to the stencil for powerful cleaning capability. Stencils are cleaned within minutes at a fraction of the cost of comparable systems.
SC-500HE
High-efficiency ultrasonic cleaning system for regular production environments. Effective on even the most challenging fine-pitch apertures.
SC-AH600 Ecobrid
Eco-friendly hybrid cleaning system combining ultrasonic and chemical cleaning for maximum effectiveness with reduced chemical usage.
Contact us for SAWA product specifications, pricing, and demonstration arrangements.
Enquire About SAWA CleanersRequest a Quote
Provide your Gerber or CAD data and our engineering team will prepare a quote — same-day turnaround available at no extra charge.